文章摘要
靳鹏,钟伟强,李富祥,林巧力.6061铝合金分别在Q235钢和纯钛表面的反应润湿[J].材料导报,2017,31(18):59-63, 84
6061铝合金分别在Q235钢和纯钛表面的反应润湿
Reactive Wetting of Q235 Steel and Pure Ti by Molten Al 6061 Alloys
  
DOI:10.11896/j.issn.1005-023X.2017.018.013
中文关键词: 反应润湿 前驱膜 热浸镀
英文关键词: reactive wetting, precursor film, hot dip
基金项目:国家自然科学基金(51665031;51465032)
作者单位
靳鹏 兰州理工大学省部共建有色金属先进加工与再利用国家重点实验室,兰州 730050 
钟伟强 兰州理工大学省部共建有色金属先进加工与再利用国家重点实验室,兰州 730050 
李富祥 兰州理工大学省部共建有色金属先进加工与再利用国家重点实验室,兰州 730050 
林巧力 兰州理工大学省部共建有色金属先进加工与再利用国家重点实验室,兰州 730050 
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中文摘要:
      采用座滴法在高真空条件下研究了熔融6061铝合金在600~700 ℃分别与Q235钢和纯钛的润湿行为。研究表明两者都为典型的反应润湿,且最终润湿性随着温度的升高而改善;界面反应的自由能变化对最终润湿性及界面结构影响较小,而基板金属在铝中的溶解度不同决定了界面反应层厚度(即溶解度越大则反应层越厚);三相线附近的还原反应诱发了前驱膜的产生,且最终润湿性越好则前驱膜越宽;两者体系的铺展动力学均可以由RPC模型描述:在Al/Ti体系中整个润湿过程分为两个阶段,即先非线性铺展,后线性铺展阶段,两个阶段的铺展活化能分别为72 kJ/mol、118 kJ/mol,且界面上存在Si的富集;在Al/Q235钢体系中整个润湿过程呈线性铺展,铺展活化能为86 kJ/mol,无Si元素在界面富集。
英文摘要:
      Wetting of Q235 steel and pure Ti by Al 6061 alloy were studied by modified sessile drop method at 600~700 ℃ under high vacuum. The results showed two systems were typically reactive wetting, and the wettability was improved with the increase of temperature. The negligible effect of interfacial reactivity on final wettability and interfacial structures, and the solubility of base metal in Al determined the thickness of reaction layer (the larger solubility and the larger thickness). Reduction reaction at close of triple line induced the formation of precursor film (the better final wettability and the wider precursor film). The spreading dynamic, both of these two wetting systems could be described by RPC model. For Al/Ti system, the wetting behaviors could be divided into two stages, i.e., first nonlinear spreading and then linear spreading, the activation energies for these two stages were 72 kJ/mol, 118 kJ/mol, and Si segregation at the solid/liquid interface could be found. For Al/Q235 steel system, only one linear spreading stage could be found, the activation energy was 86 kJ/mol, and almost no trace of Si segregation at the solid/liquid interface was found.
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